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Emerson’s AVENTICS™ Series Advanced Valve System with Advanced Electronic System is the first valve system to offer integrated OPC UA (Open Platform Communications Unified Architecture) functionality. This helps engineers at packaging manufacturers to solve interoperability challenges, simplify communication with upper level systems, reduce complexity and costs and make it easier for users to digitally transform their operations. The pneumatic valve system also features an integrated digital twin, which can help improve productivity and efficiency.
See this solution in live action at Emerson booth N4736 (North Hall) at Pack Expo in Chicago, Illinois USA, from October 23-26, 2022. Or read more via the link below.
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