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design-engineering.comJuly 15, 2020
Master bond

Ultra Low Thermal Resistance Adhesives for Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. Learn more about why ultra low thermally resistance adhesives are the preferred fastening approach in applications requiring careful thermal management. » Learn More

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