Adhesives For Heat Transfer

Flip through six of Master Bond's top performing systems for heat transfer. These systems are well suited for a variety of bonding, sealing, coating and encapsulation applications and offer a variety of superior properties.

Video on EP39MAOHT: Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm

This video demonstrates mixing, flow and performance properties of EP39MAOHT. Master Bond EP39MAOHT offers a combinations of a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This room temperature curing system offers excellent thermal conductivity and electrical insulation.

White Paper: Selecting Adhesive and Potting Compounds for High Power and High Frequency Electronics

Advanced power and high frequency electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives.

Learn more about how adhesives aid in thermal management, and how the different chemistries may be better suited for differing applications.

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