|
 |
|
|
| |
| |
|
| |
|
VIDEO SPOTLIGHT
|
|
How Do You Use EP4EN-80 for Potting & Encapsulation Applications?
|
| |
|
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.
|
| |
|
|
| |
|
|
| |
| |
| |
|
|
PRODUCT SPOTLIGHT
|
|
One Part, 85°C Curing Epoxy for Chip Coating Applications
|
|
|
| |
|
| |
|
Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that can be used for bonding, sealing, coating, and especially glob tops and small encapsulations. This epoxy is not premixed & frozen, and is ideal for applications where heat curing above 200°F is not possible.
|
| |
|
|
|
| |
|
|
|
| |
| |
|
|
CASE STUDY
|
|
EP41S-5: Utilized in the terascale generation of polymer microparticles
|
|
|
| |
|
| |
|
Chosen for its chemical resistance, EP41S-5 has been successfully utilized to prevent leaks and damage from dichloromethane flowing through a microfluidic particle generator. Read this real-life case study to see how EP41S-5 helped engineers achieve their desired results.
|
| |
|
|
|
| |
|
|
|
| |
| |
Tell us about your application
Speak one-on-one with our techincal specialists today
Or give us a call: +1.201.343.8983
|
|
|
|
| |
|
| |
|
|
| |
Master Bond Inc. | www.masterbond.com | +1.201.343.8983
154 Hobart Street, Hackensack, New Jersey 07601 USA
|
| |
Copyright © 2023 by Master Bond Inc. All Rights Reserved.
This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
|
| |
|
| | |
