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Industrial Adhesives for Design Engineers
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Master Bond has over 40 years of experience formulating adhesives for challenging applications in the medical, electronic, and OEM industries.
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VIDEO SPOTLIGHT
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One Part, Silver Filled Epoxy for EMI/RFI Shielding
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Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety of substrates. Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating.
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PRODUCT SPOTLIGHT
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Fast Setting, Color Coded Two Component Epoxy for Bonding and Sealing
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Master Bond EP51CC is a fast setting epoxy with convenient handling and good physical properties. Most significant, it turns uniformly gray when fully mixed. This non-drip compound is ideal for bonding or sealing applications and features a forgiving one to one mix ratio by weight or volume. It can be mixed and cured at temperatures as low as 50-60°F.
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CASE STUDY
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EP21TDCS-LO: A Silver Conductive Epoxy Adhesive for Space Applications
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Master Bond EP21TDCS-LO conductive epoxy met critical requirements for maintaining robust bonds in electromechanical systems intended to operate in space conditions. Read this real-life case study to see how EP21TDCS-LO ensured high strength, conductive bonds in two space-environment assembies.
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Tell us about your application
Speak one-on-one with our techincal specialists today
Or give us a call: +1.201.343.8983
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Master Bond Inc. | www.masterbond.com | +1.201.343.8983
154 Hobart Street, Hackensack, New Jersey 07601 USA
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Copyright © 2023 by Master Bond Inc. All Rights Reserved.
This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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