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Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. It possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F. This compound can be applied in ultra thin bond lines and exhibits very low thermal resistance of 2-3 x 10 -6 K•m2/W.
Master Bond
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Improve test point identification, PCB production testing and service troubleshooting withColor-Keyed, SMT Test Points. High-temperature Nylon bases allow for solder operations of up to 150° C. Available in red, black, white, yellow, orange, brown, green, blue, purple and gray colors from Keystone’s global distribution network and online.
EMX Enterprise
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M series connectors are lightweight triplestart ratchet coupling type connectors designed for avionics, aerospace, military, security, motorsport and heavy-duty applications.
The products is a COTS (Commercial Off-The-Shelf), fulfils various MIL –spec requirements and answer most of the MIL-DTL-38999 requirements.
The connectors are smaller in size for the same number of pins than standard MIL 38999 products.
MAIN FEATURES:
Multipole 2 to 114 contacts
Oil and fuel resistant
Temp. range -50°C to 200°C
High vibration resistance (gunfire test)
High shock resistance
Nicoral salt spray corrosion resistant
Lemo
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Equipto’s new TEMPEST PC concept provides the ultimate in secure operation. Choose an up-to-date ATX motherboard, or HP or Dell i7 PC repackaged for EMI and physical protection. Certified to the strictest standard in the industry for devices operating in NATO Zone 0 environment, NATO SDIP-27 Level A.
Equipto
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The spread of COVID-19 has reached unprecedented heights with the cancellation of major sports leagues and Prime Minister Justin Trudeau going into self-isolation. As the virus advances, employers are staring down decisions on social distancing, work-from-home policy and crisis communications with employee health and safety top of mind. Join our webinar on March 19 at 3:30 p.m. as we will discuss employer responsibilities in times of pandemics and emergencies.
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