Master Bond EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F and can be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance of 7-10 x 10-6 K•m2/W.

Omnetics' Micro Circular Connector Series utilizes Omnetics' rugged and reliable Flex-Pin contact system, is spaced on 50 mil (1.27mm) centerlines, features a mated length of less than 12.4 mm, and is specified to MIL-DTL-83513. Omnetics’ delivers an extensive array of micro and nano circular connector styles and formats, including a line of IP67 water-proof connectors and cables. Multiple metal shell options provide the designer a variety of locking systems.
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