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MMMM d, yyyy |
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Outlining the company's revamped strategy to strengthen both its hardware and its creative content, Yoshida said Sony plans to invest 1 trillion yen ($9 billion) mostly in image sensors over the next three years.
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Wilfrid Laurier University collaborates with scaling experts to launch 15-city Canadian tour
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Artificial Intelligence (AI) has emerged as the most frequently mentioned theme in discussions among the key disruptive technologies during the first quarter (Q1) of 2018 on Twitter, according to leading data and analytics company GlobalData.
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Infineon's new TRENCHSTOP™ Advanced Isolation delivers 0.2% higher efficiency and 10% lower cooling effort along with higher reliability. Additionally, it delivers 35% lower Rth(j-h) compared to Iso-foil and 50% reduction compared to Full-Paks. For increased power density, it offers up to 10˚C lower Tc compared to standard TO-247 with isolation material, plus up to 20% Iout increase for higher power output. By eliminating the need for thermal grease or thermal interface sheets, TRENCHSTOP Advanced Isolation also provides at least a10% system cost reduction—lowering system complexity, development time and assembling costs.
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Today, electronic designs are highly integrated components and are based on various technologies. If you want to measure small parts of signals in the presence of large amplitudes, you need an oscilloscope with a high vertical resolution. Digital oscilloscopes typically have a vertical resolution of 8 bit. But a 10-bit analog-to-digital converter (ADC) has four times more resolution than an 8-bit ADC
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| Sponsored content brought to you by: Rohde & Schwarz | | | | | | | | | | | | | | | | |
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Power Integrity Infographic is a handy resource for verifying power rail tolerances and includes common PI measurements, test equipment measurement challenges, power integrity probing methods, and more.
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KEYSTONE Coil spring contacts are designed to slide into molded cases with no wire lead, serving as a direct placement onto a pcb.
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KEYSIGHT TECHNOLOGIES PROPSIM F64 5G Channel (NR)-ready channel emulation solution enables chipset, device and network equipment manufacturers to characterize end-to-end system performance of the latest 4G and 5G base stations and mobile devices
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MASTER BOND MasterSil 154 two component, silver colored, electrically conductive silicone compound provides high performance bonding and sealing.
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SAMTEC SEARAY right-angle connectors come in ANSI/VITA 74.0-2017 Small Form Factor Base Standard, which specifies 12.5mm and 19mm stack height plug-in modules.
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June 4 - 7
Location: Hyatt Regency in Vancouver
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June 7
Location: Glenmore Inn & Convention Centre
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