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Semiconductors & Ics News 

Fujitsu completes post-K supercomputer CPU prototype, begins functionality trials

Fujitsu Ltd. and RIKEN recently announced that the joint development of post-K, a supercomputer that Japan’s Ministry of Education, Culture, Sports, Science and Technology (MEXT) has set forth as a successor to the K computer, is moving forward, with the goal of beginning full operations around 2021.

Interaction of paired and lined-up electrons can be manipulated in semiconductors

The way that electrons paired as composite particles or arranged in lines interact with each other within a semiconductor provides new design opportunities for electronics, according to recent findings from Nature Research.

Global semi industry reaches $115.8B in Q1

Global semiconductor industry revenue declined 3.4 percent in the first quarter of 2018 falling to $115.8 billion. Semiconductor industry performance was negatively affected by the declining sales and first-quarter seasonality in the wireless communications market.
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MPD Dual Port USB Chargers with 3.4 A Output

MPD’s AS234A-A is an upgraded version of its AS232 with total output increased from 2.1 A to 3.4 A. Enhanced water-resistant design with no assembly gap on the front face means fewer chances of water getting in. Raised surface also helps prevent water from getting into the USB port. The specially designed sealing PVC cap protects the chargers against even powerful water jets (when sealed). Class leading 3.4 A charges multiple devices at full speed and provides reliable output with EMC suppression and full short circuit/overheat protection. >> Learn more
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US and China continue brawl over high technology

To understand why the United States and China stand on the brink of a trade war, consider the near-death experience of American Superconductor Corp. The company, known as AMSC and based in Massachusetts, was reeling after a Chinese partner stole its technology – the electronic brains that run wind turbines. » Read More

Heat Resistant Epoxy for Die Attach Applications

Master Bond EP17HTDA-1 one component epoxy features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 has superb temperature resistance with serviceability from -80°F to +600°F and a Tg of 195-205°C. >> Learn more

Packages serve extreme demands of GaN, GaAs devices

STRATEDGE Line of packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) semiconductor devices, serving the critical requirements of the telecom, mixed signal, VSAT, broadband wireless. » Read More

Processors meet advanced A/V, smart home requirements

NXP Semiconductors i.MX 8M family of applications processors enables embedded designers to meet the new standards of user interface, intelligence and connectivity set by consumer electronic devices. » Read More

FPGA solution opens doors for rapid deployment of machine learning inferencing

LATTICE SEMICONDUCTOR sensAI complete technology stack combines modular hardware kits, neural network IP cores, software tools, reference designs and custom design services – to accelerate integration of machine learning inferencing into broad market IoT applications. » Read More

Imaging sensor enhances NIR sensitivity in extreme low-light

ON SEMICONDUCTOR Model KAE-08152 Interline Transfer Electron Multiplying CCD (ITEMCCD) image sensor  targets extreme low-light applications such as medical and scientific imaging. » Read More

EPTECH Winnipeg

September 18
Location: Victoria Inn and Convention Centre
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EPTECH Mississauga

October 2
Location: Mississauga Convention Centre
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EPTECH Waterloo

October 4
Location: Bingemans Conference Centre
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