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July 10, 2019 |
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Smart technologies took centre stage at SEMICON West 2019, the flagship U.S. event for connecting the electronics manufacturing and design supply chain.
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German-based OEM of luxury automobiles AUDI AG, has become the first car maker to join SEMI – an industry association serving the global electronics manufacturing and design supply chain.
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Falling prices of DRAM and NAND memory chips are eating into the earnings of the company
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Amphenol FCI Minitek MicroSpace™ Connector System is designed based on a crimp-to-wire platform that performs at 1.8mm, 1.5mm, and 1.27mm pitch. The Minitek is designed to be highly customizable in terms of stack heights and the number of positions. These connectors are available in single and double row versions, with top and side latch configurations. The Minitek connector system offers high vibration and locking resistance, a current rating of up to 4A per contact, and Terminal Positioning Assurance (TPA)
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Industries such as biotech use liquid chromatography equipment to break down the chemical composition of complex liquids
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MASTER BOND Supreme 3CCM-85 toughened, one part epoxy system can be used for bonding, sealing, coating and especially glob tops and small encapsulation.
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TDK CORP. two evaluation kits provide an initial impression of the varied possibilities of haptic feedback that can be realized with PowerHap piezo actuators.
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GAÏA CONVERTER MGDM-205 family of quarter brick dc-dc converter with 200W power dedicated for high reliability applications.
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PICKERING ELECTRONICS Series 122 10W reed relay occupies a pcb footprint of 4mm x 4mm, facilitating a high packing density.
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October 29
Location: Bingemans Conference Centre
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