IoT the ‘new’ asbestos? / Samsung develops 12-Layer 3D-TSV chip

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October 9, 2019

News

IoT devices could be ‘asbestos of the future’

There are currently believed to be seven billion internet of things (IoT) devices worldwide. Forecasts vary, but the consensus is the number will grow exponentially over the coming years, with some estimates as high as 40 billion connected IoT devices by 2025. » Read More

Samsung develops industry’s first 12-Layer 3D-TSV chip packaging technology

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. » Read More

CUI’s electronic components business sold

Senior managers purchase concern as a private entity; Plans accelerated expansion into new tech categories » Read More

Feature

Challenges in the electronics supply chain

Mouser Electronics details how it is tackling such issues as allocation, tariffs, compliance regulations and component obsolescence. » Read More

Products

Events

IoT devices could be ‘asbestos of the future’

Samsung develops industry’s first 12-Layer 3D-TSV chip packaging technology

CUI’s electronic components business sold

Challenges in the electronics supply chain

DIN rail power supply delivers narrow 84mm width, long field life

Sample kits for high current screw terminal hardware

Double pulse test software simplifies power efficiency testing

Sensor platform speeds development of wearables

EPTECH Waterloo

EPTECH Ottawa

NXP Tech Days