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October 16, 2019

Google debuts Pixel 4 phone, wireless earbuds with AI

Google unveiled a new Pixel smartphone and other hardware devices today, all aimed at getting people even more dependent on its artificial-intelligence services.

IEEE unveils roadmap to electronics’ future

2019 Heterogeneous Integration Roadmap (HIR) identifies long-term tech requirements to inspire collaboration in the electronics industry

Creating 2D heterostructures for future electronics

New research integrates nanomaterials into heterostructures, an important step toward creating nanoelectronics
Sponsored Spotlight 

Dev Kit for Xilinx XCVU190-2FLGC2104E FPGAs

Xilinx Virtex® UltraScale™ FPGA VCU110 Development Kit offers a development environment for evaluating performance levels, system integration and bandwidth provided by Virtex UltraScale devices. This kit delivers an ideal platform for developing systems requiring massive data throughput such as 400+ Gbps systems and 28Gbps backplane applications. The VCU110 evaluation board features 144Mb QDRII+ and 2 x 576Mb RLD3 component memory, 4GB hybrid memory cube component memory, a CFP4 Quad C form-factor pluggable module connector, an Ethernet PHY, general purpose I/O, a four-lane PCI Express® interface connector, plus two UART interfaces. In stock at Learn More

AIS farms an electric autonomous robot

Riding the wave of receiving substantial funding support from the Federal Government, Burnaby-based Advanced Intelligent Systems (AIS) has set out to develop an autonomous electric vehicle that will solve several pain points for customers. » Read More
EMX Enterprises

‘Zero’ height threaded inserts serve pcbs

EMX ENTERPRISES Keystone Electronics series of ultra-low profile, surface mountable threaded inserts are packaged for use on printed circuit boards (pcb) in the same manner as other SMT components » Learn more
Master Bond

Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. » Learn more

Low-height bracket fan cools with skived copper heatsink

JARO THERMAL Skived-copper bracket fan contains a fully embedded, 50x50x12.6mm fan - inside of a skived-copper-fin heatsink. » Learn more

Peltier cooler modules operate in elevated temperatures, deliver spot cooling

LAIRD THERMAL SYSTEMS HiTemp ET Series is a Peltier cooler delivers active spot cooling and can lower the control temperature by as much as 40°C below ambient dependent on active heat load. » Learn more

EPTECH Waterloo

October 29
Location: Bingemans Conference Centre
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October 31
Location: Brookstreet Hotel
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NXP Tech Days

November 7
Location: Hilton Toronto/Markham Suites Conference Centre
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