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January 13, 2020
Enclosures / Thermal Management News  

Heat model may help electronic devices last longer

Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage

Myant enters joint venture with Osmotex

Firms plan to integrate, commercialize HYDRO_BOT electronic moisture management technology for textile-based applications

Selecting the optimal thermal management technology

How to choose a cooling unit that protects electronics in a specific application
Sponsored Spotlight 

Underfill Epoxy Offers Thermal Conductivity and Long Working Life

Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle size filler material. EP29LPTCHT can be easily dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12-15 x 10-6 K•m2/W.
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Enclosures / Thermal Management Feature 

A brief overview of NEMA rated enclosures

A great deal of consideration must be put into a facility’s various equipment installs and their respective interconnects » Read More
Enclosures / Thermal Management Products 

Wall mount/desktop plastic enclosures sealed to IP68

HAMMOND 1557 family of wall mount/desktop plastic enclosures are initially available in four plan sizes, each in two heights. » Read More

Pin/slot fin coolers serve modular LED products

JARO THERMAL PinFIN (JX) series of LED (heatsink) coolers meet the specific power requirements of LED down lights, spotlights and high-bay lights (from 45-225mm in diameter). » Read More

Urethane based epoxy system meets USP Class VI specs

MASTER BOND EP30DPBFMed two part, flexible epoxy-urethane hybrid system can be used for bonding, sealing, coating and encapsulation. » Read More

High-resolution OEM thermal cameras integrate with most designs

SEEK THERMAL Micro and Mosaic Core series of OEM thermal cameras can be integrated into products and services across several industries. » Read More
EPTech 2020

Printable, Flexible & Hybrid Electronics

January 21
Location: Waterloo Institute for Nanotechnology
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February 4 - 6
Location: San Diego Convention Center
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FLEX 2020 and MEMS & Sensors

February 24 - 27
Location: DoubleTree by Hilton
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