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January 13, 2020 |
| Enclosures / Thermal Management News | | | | | | | | | | | | | | | | |
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Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage
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Firms plan to integrate, commercialize HYDRO_BOT electronic moisture management technology for textile-based applications
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How to choose a cooling unit that protects electronics in a specific application
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Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle size filler material. EP29LPTCHT can be easily dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12-15 x 10-6 K•m2/W.
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| Enclosures / Thermal Management Feature | | | | | | | | | | | | | | | | |
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A great deal of consideration must be put into a facility’s various equipment installs and their respective interconnects
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| Enclosures / Thermal Management Products | | | | | | | | | | | | | | | | |
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HAMMOND 1557 family of wall mount/desktop plastic enclosures are initially available in four plan sizes, each in two heights.
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JARO THERMAL PinFIN (JX) series of LED (heatsink) coolers meet the specific power requirements of LED down lights, spotlights and high-bay lights (from 45-225mm in diameter).
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MASTER BOND EP30DPBFMed two part, flexible epoxy-urethane hybrid system can be used for bonding, sealing, coating and encapsulation.
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SEEK THERMAL Micro and Mosaic Core series of OEM thermal cameras can be integrated into products and services across several industries.
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January 21
Location: Waterloo Institute for Nanotechnology
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February 4 - 6
Location: San Diego Convention Center
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February 24 - 27
Location: DoubleTree by Hilton
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