Tech Update Enewsletter – Thermal Management & Enclosures

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CONNECTORS NEWS

Thermal Hero creates North American beach head

German-based provider of thermal management products » Read More...

UCLA researchers develop solid-state thermal transistor

Electronic device switches on and off heat at top speed with precision » Read More...

How EMI shielding is enabling compact electronics

It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. This proximity means that conventional board-level shielding of electromagnetic interference (EMI) with metal enclosures is being replaced with package-level shielding, with metallic coatings applied directly to semiconductor packages. » Read More...

CONNECTORS FEATURE

Component sealing’s pressure paradox

Allowing airflow while preventing water and hazardous media penetration is among electrical component manufacturing’s most persistent push-pulls » Read More...

CONNECTORS PRODUCTS

Refrigerant-free, thermoelectric coolers boost performance in enclosures

LAIRD THERMAL SYSTEMS SuperCool X Series next-gen high-performance thermoelectric cooler assembly series utilizes advanced semiconductor materials. » Read More...

Solder paste serves AI substrate power management modules

SHENMAO PF719-P250A solder paste is specifically designed for AI substrate power management modules, providing advancement in thermal fatigue reliability and performance. » Read More...

Thermal solutions meet high-performance demands

KERAFOL & X2F State-of-the-art thermal management solutions for electronic devices leverage the advantages of Kerafol’s thermally conductive materials and X2F’s patented controlled-viscosity molding technologies. » Read More...

Fan-and-filter units ensure enclosure operational security

RITTAL Blue e+ series of fan-and-filter units enhance operational security for enclosures, while providing an emergency cooling function and smart climate control features. » Read More...

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