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Brought to you by EPTECH
Join us at EPTECH across Canada this year and showcase your products to Canada’s electronics design and engineering community. Sign Up Today
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German-based provider of thermal management products
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Electronic device switches on and off heat at top speed with precision
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It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. This proximity means that conventional board-level shielding of electromagnetic interference (EMI) with metal enclosures is being replaced with package-level shielding, with metallic coatings applied directly to semiconductor packages.
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Allowing airflow while preventing water and hazardous media penetration is among electrical component manufacturing’s most persistent push-pulls
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LAIRD THERMAL SYSTEMS SuperCool X Series next-gen high-performance thermoelectric cooler assembly series utilizes advanced semiconductor materials.
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SHENMAO PF719-P250A solder paste is specifically designed for AI substrate power management modules, providing advancement in thermal fatigue reliability and performance.
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KERAFOL & X2F State-of-the-art thermal management solutions for electronic devices leverage the advantages of Kerafol’s thermally conductive materials and X2F’s patented controlled-viscosity molding technologies.
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RITTAL Blue e+ series of fan-and-filter units enhance operational security for enclosures, while providing an emergency cooling function and smart climate control features.
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Global Conference & Exhibition
June 12 - 13 @ UMass Boston, USA
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