It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. This proximity means that conventional board-level shielding of electromagnetic interference (EMI) with metal enclosures is being replaced with package-level shielding, with metallic coatings applied directly to semiconductor packages.» Read More...
Allowing airflow while preventing water and hazardous media penetration is among electrical component manufacturing’s most persistent push-pulls » Read More...
LAIRD THERMAL SYSTEMS SuperCool X Series next-gen high-performance thermoelectric cooler assembly series utilizes advanced semiconductor materials. » Read More...
SHENMAO PF719-P250A solder paste is specifically designed for AI substrate power management modules, providing advancement in thermal fatigue reliability and performance. » Read More...
RITTAL Blue e+ series of fan-and-filter units enhance operational security for enclosures, while providing an emergency cooling function and smart climate control features. » Read More...