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| SEMICONDUCTORS & INTERCONNECTED DEVICES NEWS |
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Industry leaders to gather in Kanata on April 29-30
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Brought to you by Mouser
Heat is an unwanted byproduct of electric vehicles, making the motor less efficient. Here’s a new solution to cooling EV motors.
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Another future trend predicted by IDTechEx is advanced 3D stacking, whereby interconnectivity and thermal management can be improved
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Nvidia announced that it will produce its artificial intelligence super computers in the United States for the first time.
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Teledyne LeCroy High Definition Oscilloscopes (HDO®) consistently deliver 12 bits of resolution at full bandwidth ratings, ensuring no tradeoff between resolution, sample rate, or bandwidth. Users experience clean, crisp waveforms, revealing more signal details and unmatched measurement precision. Once you use a Teledyne LeCroy HDO, you'll never want to switch to another oscilloscope.
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| SEMICONDUCTORS & INTERCONNECTED DEVICES FEATURE |
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Toronto-based developers tackle monster power demands of processing neural networks
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| SEMICONDUCTORS & INTERCONNECTED DEVICES PRODUCTS |
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ADVANCED LINEAR DEVICES ALD910030 Supercapacitor Auto-Balancing (SAB) MOSFET provides improved auto-balancing capabilities and power management
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HIROSE ELECTRIC FH52C Series compact carbon-ink-circuit (CIC) connector features a contact design to prevent carbon-ink scraping and paste damage.
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ONSEMI EliteSiC SPM 31 IPMs are first generation 1200V silicon carbide (SiC) metal oxide semiconductor field-effect transistor (MOSFET) based SPM 31 intelligent power modules (IPMs).
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SAMTEC Si-Fly HD co-packaged and near-chip systems provide high density 224 Gbps PAM4 solution.
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National Instruments hosts NI Connect
Fort Worth, Texas
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Who: top executives, policymakers & innovators from Canada, U.S. and global markets.
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DoubleTree par Hilton Pointe-Claire Montréal Aéroport Ouest
10a.m. to 4p.m. Free registration & parking
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