EP&T Tech Update – Thermal Management & Enclosures
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Thermal Management & Enclosures News

Radiation-tolerant dc-dc converter modules power AI1 transponder for computing applications

System design is further compounded by the complexities of managing thermal and radiation conditions in space.

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Top 10 connectivity and electronics design predictions for 2026

Energy consumption hampers data-center scaling, propelling advancements in thermal management

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DigiKey develops custom enclosure configurator tool

DigiKey global electronic component distributor, introduced a Custom Enclosure Configurator, an online service to quickly and easily customize stock enclosures.

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Hammond’s ‘Hamboni’ takes a lap at DigiKey’s home arena

Guelph-based enclosure supplier sponsors a Zamboni in Minnesota community rink

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Thermal Management & Enclosures Feature

Unlocking silent, ultra-thin design for consumer electronics

As AI usage continues to gain traction, system designers must balance the demand for smaller form factor devices with higher performance capabilities that generate significantly more heat.

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Thermal-fused AI

The missing link in meeting 100% pass rate for FMVSS No. 127's

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Sponsored Spotlight

Reliable Cooling for Harsh Environments

Designed for extreme conditions, Orion Fans deliver reliable airflow where heat, dust, and vibration are constant. Ideal for harsh environment enclosures that demand consistent thermal performance.

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Thermal Management & Enclosures Products

Electrically insulating epoxy delivers high thermal conductivity

MASTER BOND EP54TC two-component epoxy is engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring high thermal conductivity, product exceeds 6 W/(m·K), delivering enhanced heat dissipation while remaining...

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IP68 heavy duty flanged die-cast aluminum enclosures deliver strong, smooth mounting plate

HAMMOND MANUFACTURING IP68 1550ZF range flanged versions join all 18 sizes of firm’s established 1550Z rugged thick wall heavy duty die-cast enclosure family.

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Cold-forged pin-fin IC cooler delivers ultra-thin standard

JARO THERMAL Cold-Forged Pin-Fin IC Coolers feature a cold-forged pin-fin heatsink core

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Aluminium enclosures meet a wide range of applications

BOPLA range of aluminium enclosure types combine sturdy construction with environmental protection up to IP69

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