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The Latest High-Performance Thermal Interface Material for Efficient Heat Dissipation in Delicate Components. Fujipoly® unveils a low compression force, putty-like TIM suitable for variable component heights. With a thermal conductivity of 6.5 W/m°K, it fills gaps between heat sources and heatsinks, enhancing cooling. Available in 0.5mm to 2mm thicknesses, PG65A reduces stress on PCB during assembly. Choose from precut or custom dimensions. Ideal for -40 to +125°C operating temperatures.
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