How Do You Use EP4EN-80 for Potting & Encapsulation Applications?
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used while observing its flowability and ease of use.
One Part, 85°C Curing Epoxy for Chip Coating Applications
Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that can be used for bonding, sealing, coating, and especially glob tops and small encapsulations. This epoxy is not premixed & frozen and features thermal conductivity and electrical insulation. It is suitable for applications where heat curing above 200°F is not possible.
Master Bond MasterSil 151S is an addition curing, two part silicone that may be used as an adhesive, sealant, coating or form-in-place gasketing material. A unique feature of this product is that despite its silicone chemistry, it passes NASA low outgassing specifications. Scroll through our infographic to discover more.
